Dab tsi yog hom PCB boards?

Kev faib tawm hauv qab mus rau sab saum toj yog raws li hauv qab no:
94HB/94VO/22F/CEM-1/CEM-3/FR-4
Cov ntsiab lus yog raws li nram no:
94HB: Ordinary cardboard, tsis fireproof (cov khoom qib qis tshaj, tuag xuas nrig ntaus, tsis tuaj yeem siv los ua lub hwj chim board)
94V0: nplaim retardant cardboard (tuag xuas nrig ntaus)
22F: Ib sab ib nrab iav fiber ntau pawg thawj coj saib (tuag xuas nrig ntaus)
CEM-1: Ib leeg-sided fiberglass board (yuav tsum tau laum los ntawm lub computer, tsis punched)
CEM-3: Ob chav sided semi-fiberglass board (tshwj tsis yog ob-sided cardboard, uas yog cov khoom siv qis tshaj plaws rau ob sab vaj huam sib luag. Yooj yim ob sab panels siv tau cov khoom no, uas yog 5 ~ 10 yuan / square. ' meter ' pheej yig dua FR-4)
FR-4: Ob chav sided fiberglass board
Teb zoo tshaj
1.c Kev faib tawm ntawm cov nplaim hluav taws xob tuaj yeem muab faib ua plaub hom: 94V-0 / V-1 / V-2 thiab 94-HB
2. Prepreg: 1080 = 0.0712mm, 2116 = 0.1143mm, 7628 = 0.1778mm
3. FR4 CEM-3 yog lub rooj tsavxwm, fr4 yog lub iav fiber ntau pawg thawj coj saib, CEM3 yog cov sib xyaw substrate
4. Halogen-dawb yog hais txog cov khoom siv hauv paus uas tsis muaj halogen (fluorine, bromine, iodine thiab lwm yam khoom), vim tias bromine yuav tsim cov pa phem thaum hlawv, uas yuav tsum tau muaj los ntawm kev tiv thaiv ib puag ncig.
Tsib.Tg yog lub iav hloov kub, uas yog, lub melting point.
Lub rooj tsav xwm hluav taws xob yuav tsum yog nplaim hluav taws, nws tsis tuaj yeem hlawv ntawm qhov kub thiab txias, nws tsuas yog muag.Qhov ntsuas kub ntawm lub sijhawm no yog hu ua iav hloov pauv kub (Tg point), thiab tus nqi no cuam tshuam rau qhov kev ruaj ntseg ntawm PCB pawg thawj coj saib.

Dab tsi yog qhov siab Tg PCB Circuit Board thiab qhov zoo ntawm kev siv lub siab Tg PCB
Thaum qhov kub ntawm Tg cov ntawv luam tawm siab nce mus rau ib qho chaw, lub substrate yuav hloov ntawm "iav xeev" mus rau "lub xeev roj hmab", thiab qhov kub ntawm lub sij hawm no yog hu ua iav hloov kub (Tg) ntawm lub rooj tsavxwm.Ntawd yog, Tg yog qhov kub siab tshaj (° C.) uas lub substrate tseem nruj.Qhov ntawd yog hais tias, cov ntaub ntawv zoo tib yam PCB substrate tsis tsuas yog soften, deform, yaj, thiab lwm yam nyob rau hauv high kub, tab sis kuj qhia ib tug ntse poob ntawm txhua yam thiab hluav taws xob zog (Kuv xav tias koj tsis xav pom qhov teeb meem no nyob rau hauv koj tus kheej cov khoom. los ntawm saib kev faib tawm ntawm PCB boards.).Thov tsis txhob luam cov ntsiab lus ntawm lub xaib no
Feem ntau, Tg ntawm lub phaj siab tshaj 130 degrees, qhov siab Tg feem ntau yog siab dua 170 degrees, thiab qhov nruab nrab Tg siab tshaj 150 degrees.
Feem ntau, PCB luam ntawv boards nrog Tg ≥ 170 ° C yog hu ua siab Tg luam ntawv boards.
Lub Tg ntawm lub substrate yog nce, thiab lub tshav kub tsis kam, noo noo tsis kam, tshuaj tiv thaiv, thiab stability ntawm cov ntawv luam tawm yuav raug txhim kho thiab txhim kho.Qhov siab dua TG tus nqi, qhov zoo dua qhov ntsuas kub ntawm lub rooj tsavxwm, tshwj xeeb tshaj yog nyob rau hauv cov txheej txheem tsis muaj txhuas, muaj ntau qhov kev siv Tg siab.
High Tg txhais tau hais tias siab kub ua hauj.Nrog rau kev loj hlob sai ntawm kev lag luam hluav taws xob, tshwj xeeb tshaj yog cov khoom siv hluav taws xob uas sawv cev los ntawm cov khoos phis tawj, tab tom txhim kho mus rau kev ua haujlwm siab thiab ntau txheej txheej, uas yuav tsum tau ua kom muaj cua sov ntau dua ntawm cov khoom siv hluav taws xob hauv PCB raws li qhov tseem ceeb lav.Kev tshwm sim thiab kev loj hlob ntawm high-density mounting technologies sawv cev los ntawm SMT thiab CMT tau ua PCB ntau thiab ntau inseparable los ntawm kev txhawb siab kub tsis kam ntawm lub substrate nyob rau hauv cov nqe lus ntawm me me aperture, nplua kab, thiab thinning.

Yog li ntawd, qhov sib txawv ntawm cov dav dav FR-4 thiab siab Tg FR-4 yog tias cov khoom siv dag zog, qhov ruaj khov, kev ruaj khov, kev nqus dej, thiab thermal decomposition ntawm cov khoom yog nyob rau hauv lub xeev kub, tshwj xeeb tshaj yog thaum tshav kub tom qab nqus noo noo.Muaj qhov sib txawv ntawm ntau yam xws li thermal expansion, thiab cov khoom siab Tg yog pom tseeb zoo dua li cov khoom siv PCB substrate.
Nyob rau hauv xyoo tas los no, tus naj npawb ntawm cov neeg siv khoom uas xav tau siab Tg luam ntawv boards tau nce xyoo los ntawm xyoo.
PCB cov ntaub ntawv kev paub thiab cov qauv (2007/05/06 17:15)
Tam sim no, muaj ntau hom tooj liab-clad boards dav siv nyob rau hauv kuv lub teb chaws, thiab lawv cov yam ntxwv muaj nyob rau hauv cov lus hauv qab no: hom tooj liab clad boards, kev paub txog tooj liab-clad boards.
Muaj ntau ntau txoj kev faib cov tooj liab clad laminates.Feem ntau, raws li cov ntaub ntawv sib txawv ntawm lub rooj tsavxwm, nws tuaj yeem muab faib ua: daim ntawv puag, ntaub puag ntawm iav fiber ntau pcb board,
Composite puag (CEM series), laminated multi-layer board puag thiab cov khoom tshwj xeeb hauv paus (ceramic, hlau core puag, thiab lwm yam) tsib pawg.Yog siv los ntawm board _)(^$RFSW#$%T
Cov nplaum nplaum sib txawv tau muab cais tawm, cov ntawv ua raws li CCI.Yog: phenolic resin (XPC, XxxPC, FR-1, FR

-2, thiab lwm yam), epoxy resin (FE-3), polyester cob thiab lwm yam.Cov iav fiber ntau hauv paus CCL muaj epoxy resin (FR-4, FR-5), uas yog tam sim no siv ntau hom iav fiber ntau daim ntaub puag.Tsis tas li ntawd, muaj lwm cov resins tshwj xeeb (iav fiber ntau daim ntaub, polyamide fiber ntau, tsis-woven npuag, thiab lwm yam raws li cov ntaub ntawv ntxiv): bismaleimide hloov triazine resin (BT), polyimide resin (PI), Diphenylene ether resin (PPO), txiv neej anhydride imine-styrene resin (MS), polycyanate resin, polyolefin resin, thiab lwm yam Raws li cov nplaim retardant kev ua tau zoo ntawm CCL, nws muaj peev xwm muab faib ua ob hom boards: nplaim retardant (UL94-VO, UL94-V1) thiab tsis- nplaim retardant (UL94-HB).Nyob rau hauv ib los yog ob xyoos dhau los, nrog rau qhov tseem ceeb ntawm kev tiv thaiv ib puag ncig, ib hom tshiab ntawm CCL uas tsis muaj bromine tau raug cais tawm ntawm cov nplaim hluav taws kub-retardant CCL, uas tuaj yeem hu ua "ntsuab nplaim taws-retardant CCL".Nrog rau txoj kev loj hlob sai ntawm cov khoom siv hluav taws xob, muaj kev ua tau zoo dua rau cCL.Yog li, los ntawm kev faib ua haujlwm ntawm CCL, nws tau muab faib ua kev ua haujlwm dav dav CCL, qis dielectric tas li CCL, siab kub tsis kam CCL (feem ntau L ntawm lub rooj tsavxwm yog siab dua 150 ° C), thiab qis thermal expansion coefficient CCL (feem ntau siv rau ntim substrates)) thiab lwm yam.Nrog rau kev txhim kho thiab kev vam meej ntawm kev siv tshuab hluav taws xob tsis tu ncua, cov kev xav tau tshiab tau muab tso rau yav tom ntej rau cov ntawv luam tawm cov ntaub ntawv substrate, yog li txhawb kev txhim kho txuas ntxiv ntawm tooj liab clad laminate qauv.Tam sim no, cov qauv tseem ceeb rau cov khoom siv substrate yog raws li hauv qab no.

①National standard Tam sim no, kuv lub teb chaws cov qauv rau kev faib cov ntaub ntawv substrate pcb boards muaj xws li GB/T4721-47221992 thiab GB4723-4725-1992.Tus qauv rau tooj liab clad laminates hauv Taiwan, Tuam Tshoj yog CNS tus qauv, uas yog raws li Japanese JIs tus qauv., tso tawm xyoo 1983. gfgfgfggdgeeeejhjj

② Cov qauv tseem ceeb ntawm lwm cov qauv hauv tebchaws yog: JIS tus qauv ntawm Nyiv, ASTM, NEMA, MIL, IPc, ANSI, UL tus qauv ntawm Tebchaws Meskas, Bs tus qauv ntawm Tebchaws Askiv, DIN thiab VDE tus qauv ntawm lub teb chaws Yelemees, NFC thiab UTE tus qauv ntawm Fabkis, CSA ntawm Canada Standards, Australia tus qauv AS, lub qub Soviet Union tus qauv FOCT, thoob ntiaj teb IEC tus qauv, thiab lwm yam.
Cov neeg muag khoom ntawm cov ntaub ntawv tsim PCB feem ntau yog siv los ntawm txhua tus neeg: Shengyi \ Jiantao \ International, thiab lwm yam.
● Cov ntaub ntawv lees paub: protel autocad powerpcb orcad gerber lossis cov ntawv luam tawm, thiab lwm yam.
● Phaj hom: CEM-1, CEM-3 FR4, siab TG khoom;
● Qhov siab tshaj plaws pawg thawj coj saib loj: 600mm * 700mm (24000mil * 27500mil)
● Ua board thickness: 0.4mm-4.0mm (15.75mil-157.5mil)
● Cov txheej txheem ntau tshaj plaws: 16 Layers
● Copper foil txheej thickness: 0.5-4.0 (oz)
● Tiav phaj thickness kam rau ua: +/- 0.1mm (4mil)
● Moulding dimension kam rau ua: Khoos phib tawj milling: 0.15mm (6mil) Tuag stamping: 0.10mm (4mil)
● Tsawg kawg kab dav / qhov sib nrug: 0.1mm (4mil) Kab dav tswj peev xwm: ＜+-20%
● Qhov tsawg kawg nkaus drilling txoj kab uas hla ntawm cov khoom tiav: 0.25mm (10mil)
Tiav lawm yam tsawg kawg nkaus xuas nrig ntaus qhov taub: 0.9mm (35mil)
Tiav qhov qhov kam rau ua: PTH: +-0.075mm (3mil)
NPTH: +-0.05mm (2mil)
● Tiav qhov phab ntsa tooj liab thickness: 18-25um (0.71-0.99mil)
● Yam tsawg kawg SMT suab: 0.15mm (6mil)
● Txheej txheej: tshuaj immersion kub, HASL, tag nrho board npib tsib xee plated kub (dej / mos kub), silk screen xiav kua nplaum, thiab lwm yam.
● Solder mask thickness ntawm lub rooj tsavxwm: 10-30μm (0.4-1.2mil)
● Peel zog: 1.5N / mm (59N / mil)
● Solder mask hardness: ＞5H
● Solder resistance plugging peev: 0.3-0.8mm (12mil-30mil)
● Dielectric qhov tsis tu ncua: ε = 2.1-10.0
● Rwb thaiv tsev tsis kam: 10KΩ-20MΩ
● Cov yam ntxwv impedance: 60 ohm ± 10%
● Thermal shock: 288 ℃, 10 sec
● Warpage ntawm board tiav: <0.7%
● Cov khoom siv: cov khoom siv sib txuas lus, khoom siv hluav taws xob hauv tsheb, kev ntsuas, lub ntiaj teb tso qhov system, khoos phis tawj, MP4, fais fab mov, khoom siv hauv tsev, thiab lwm yam.