Siyakwamukela kuwebhusayithi yethu.

Ikhiqizwa kanjani ibhodi lesifunda le-PCB?

IIbhodi lesifunda le-PCBishintsha njalo nenqubekelaphambili yobuchwepheshe benqubo, kodwa ngokuyisisekelo, ibhodi lesifunda eliphelele le-PCB lidinga ukuphrinta ibhodi lesifunda, bese lisika ibhodi lesifunda, licubungule i-laminate ye-copper clad, idlulise ibhodi lesifunda, i-Corrosion, i-drilling, i-pretreatment, futhi ukushisela kungavulwa kuphela ngemva kwalezi zinqubo zokukhiqiza.Okulandelayo ukuqonda okuningiliziwe kwenqubo yokukhiqiza ibhodi lesifunda le-PCB.
Dala umdwebo wohlelo ngokuya ngezidingo zomsebenzi wesekethe.Idizayini yomdwebo wohlelo ngokuyinhloko isekelwe ekusebenzeni kukagesi kwengxenye ngayinye okufanele yakhiwe ngokunengqondo njengoba kudingeka.Umdwebo ungabonisa ngokunembile imisebenzi ebalulekile yebhodi lesifunda le-PCB kanye nobudlelwano phakathi kwezingxenye ezihlukahlukene.Ukuklanywa komdwebo wohlelo kuyisinyathelo sokuqala senqubo yokukhiqiza ye-PCB, futhi kuyisinyathelo esibaluleke kakhulu.Ngokuvamile isofthiwe esetshenziselwa ukuklama ama-circuit schematics yi-PROTEl.
Ngemuva kokuthi umklamo wohlelo usuqediwe, kuyadingeka ukuthi kuqhutshekwe kuhlanganiswe ingxenye ngayinye nge-PROTEL ukuze kukhiqizwe futhi kubonakale igridi enokubukeka okufanayo nosayizi wezingxenye.Ngemva kokulungisa iphakheji yengxenye, sebenzisa Hlela/Setha Okuncamelayo/Phini 1 ukuze usethe indawo yereferensi yephakheji kuphinikhodi yokuqala.Bese wenza ukuhlola Komthetho Wombiko/Wengxenye ukuze usethe yonke imithetho okufanele ihlolwe, futhi KULUNGILE.Kuleli qophelo, iphakheji iyasungulwa.

Khiqiza ngokusemthethweni i-PCB.Ngemva kokukhiqizwa kwenethiwekhi, indawo yengxenye ngayinye idinga ukubekwa ngokuhambisana nobukhulu bephaneli ye-PCB, futhi kuyadingeka ukuqinisekisa ukuthi umkhondo wengxenye ngayinye awuweli lapho ubeka.Ngemva kokuqedwa kokubekwa kwezingxenye, ukuhlolwa kwe-DRC ekugcineni kuyenziwa ukuze kuqedwe amaphutha ephini noma okuwela umthofu wengxenye ngayinye phakathi nezintambo.Lapho wonke amaphutha eqedwa, inqubo ephelele yokuklama ye-pcb iyaphothulwa.

Ibhodi lesifunda lokuphrinta: Shicilela ibhodi lesifunda elidwetshiwe ngephepha lokudlulisa, qaphela uhlangothi olushelelayo olubheke wena, ngokuvamile phrinta amabhodi esekethe amabili, okungukuthi, phrinta amabhodi esekethe amabili ephepheni elilodwa.Phakathi kwabo, khetha lowo onomphumela omuhle kakhulu wokunyathelisa ukwenza ibhodi lesifunda.
Sika i-copper clad laminate, bese usebenzisa ipuleti le-photosensitive ukwenza yonke inqubo yomdwebo webhodi lesifunda.Ama-laminates ane-Copper-clad, okungukuthi, amabhodi wesifunda ambozwe ifilimu yethusi ezinhlangothini zombili, asike ama-laminates agqoke ithusi abe ubukhulu bebhodi lesifunda, hhayi elikhulu kakhulu, ukuze asindise izinto.

Ukwelashwa kwangaphambili kwama-laminates ane-copper clad: sebenzisa i-sandpaper ecolisekileyo ukuze upholishe ungqimba lwe-oxide ebusweni bama-laminates ane-copper clad ukuqinisekisa ukuthi i-toner ephepheni lokudlulisa elishisayo ingaphrintwa ngokuqinile kuma-laminates e-copper lapho udlulisela ibhodi lesifunda.Isiphetho esicwebezelayo esingenawo amabala abonakalayo.

Dlulisa ibhodi lesifunda eliphrintiwe: Sika ibhodi lesifunda eliphrintiwe libe usayizi ofanele, unamathisele uhlangothi lwebhodi lesifunda eliphrintiwe ku-laminate ye-copper clad, ngemva kokuqondanisa, faka i-laminate ye-copper clad emshinini wokudlulisa oshisayo, futhi uqinisekise ukudluliswa uma uyibeka ePhepha. ayiqondile.Ngokuvamile, ngemva kokudluliselwa kwe-2-3, ibhodi lesifunda lingadluliselwa ngokuqinile ku-laminate ye-copper clad.Umshini wokudlulisa oshisayo ushiswe kusengaphambili, futhi izinga lokushisa libekwe ku-160-200 degrees Celsius.Ngenxa yokushisa okuphezulu, sicela unake ukuphepha lapho usebenza!

Ibhodi lesifunda se-Corrosion, umshini wokugcwalisa u-reflow soldering: qala uhlole ukuthi ukudluliswa kuqedile yini ebhodini lesifunda, uma kunezindawo ezimbalwa ezingadluliswanga kahle, ungasebenzisa ipeni elimnyama elisekelwe kumafutha ukulungisa.Khona-ke ingagqwala.Lapho ifilimu yethusi evezwe ebhodini lesifunda igqwalile ngokuphelele, ibhodi lesifunda likhishwa oketshezini olubi futhi lihlanjululwe, ukuze ibhodi lesifunda lidliwe.Ukwakheka kwesisombululo esigqwalayo yi-hydrochloric acid egxilile, i-hydrogen peroxide egxilile, namanzi ngesilinganiso se-1: 2: 3.Lapho ulungisa isixazululo esonakalisayo, engeza amanzi kuqala, bese wengeza i-hydrochloric acid egxilile kanye ne-hydrogen peroxide egxilile.Uma i-concentrated hydrochloric acid, i-concentrated hydrogen peroxide noma i-corrosive solution ingenzi Qaphela ukuthi ufafaze esikhumbeni noma ezingutsheni bese uyigeza ngamanzi ahlanzekile ngesikhathi.Njengoba kusetshenziswa isixazululo esinamandla sokugqwala, qiniseka ukuthi unaka ukuphepha lapho usebenza!

Ukubhola kwebhodi lesifunda: Ibhodi lesifunda ukufaka izingxenye ze-electronic, ngakho-ke kuyadingeka ukubhoboza ibhodi lesifunda.Khetha ama-drill ahlukene ngokuya ngobukhulu bezikhonkwane zezingxenye ze-elekthronikhi.Uma usebenzisa i-drill ukuze ubhoboze izimbobo, ibhodi lesifunda kufanele licindezelwe ngokuqinile.Isivinini sokuprakthiza akufanele sihambe kancane.Sicela ubheke opharetha ngokucophelela.

Ukwelashwa kwangaphambili kwebhodi lesifunda: Ngemva kokubhoboza, sebenzisa i-sandpaper ecolisekileyo ukupholisha i-toner emboze ibhodi lesekethe, futhi uhlanze ibhodi lesifunda ngamanzi ahlanzekile.Ngemuva kokuthi amanzi omile, sebenzisa amanzi kaphayini ohlangothini ngesekethe.Ukuze kusheshiswe ukuqiniswa kwe-rosin, sisebenzisa umoya oshisayo wokushisa ukushisa ibhodi lesifunda, futhi i-rosin ingaqina emaminithini angu-2-3 kuphela.

Izingxenye ze-elektroniki zokushisela: Ngemva kokuba umsebenzi wokushisela usuqediwe, yenza ukuhlolwa okuphelele kulo lonke ibhodi lesifunda.Uma kunenkinga ngesikhathi sokuhlolwa, kuyadingeka ukucacisa indawo yenkinga ngomdwebo we-schematic oklanywe esinyathelweni sokuqala, bese uphinda uthengise noma ushintshe ingxenye.idivayisi.Lapho ukuhlolwa kuphasiswe ngempumelelo, lonke ibhodi lesifunda liyaphela.

I-PCBA kanye ne-PCB Board Assembly for Electronics Products

 


Isikhathi sokuthumela: May-15-2023