..1: Dweba umdwebo wohlelo.
..2: Dala ingxenye yomtapo wolwazi.
..3: Sungula ubudlelwano bokuxhumana kwenethiwekhi phakathi komdwebo wohlelo kanye nezingxenye ebhodini eliphrintiwe.
..4: Umzila nokubekwa.
..5: Dala idatha ephrintiwe yokusetshenziswa kokukhiqizwa kwebhodi kanye nedatha yokusetshenziswa kokukhiqizwa kokubekwa.
.. Ngemva kokunquma indawo nokuma kwezingxenye ku-PCB, cabangela ukuma kwe-PCB.
1. Ngesikhundla sengxenye, i-wiring yenziwa ngokusho kwendawo yengxenye.Kuyisimiso sokuthi i-wiring ebhodini eliphrintiwe ifushane ngangokunokwenzeka.Amathrekhi mafushane, futhi isiteshi nendawo okuhlala kuyo kuncane, ngakho izinga lokudlula lizoba phezulu.Izintambo zetheminali yokufaka kanye netheminali yokukhiphayo ebhodini le-PCB kufanele zizame ukugwema ukuthi zisondelene ngokuhambisana, futhi kungcono ukubeka intambo ephansi phakathi kwezintambo ezimbili.Ukuze ugweme ukuhlangana kwempendulo yesifunda.Uma ibhodi eliphrintiwe liyibhodi elinezingqimba eziningi, isiqondiso somzila womugqa wesignali wesendlalelo ngasinye sihlukile kunesendlalelo sebhodi eliseduze.Kweminye imigqa yesignali ebalulekile, kufanele ufinyelele esivumelwaneni nomklami womugqa, ikakhulukazi imigqa yesignali yokuhlukanisa, kufanele ihanjiswe ngamabili, zama ukubenza bahambisane futhi bavale, futhi ubude abuhluke kakhulu.Zonke izingxenye ze-PCB kufanele zinciphise futhi zifinyeze umkhondo nokuxhumana phakathi kwezingxenye.Ububanzi obuncane bezintambo ku-PCB ikakhulukazi bunqunywa amandla okunamathela phakathi kwezintambo kanye ne-substrate yesendlalelo sokuvikela kanye nenani lamanje eligeleza kuzo.Lapho ubukhulu be-foil yethusi bungu-0.05mm futhi ububanzi buyi-1-1.5mm, izinga lokushisa ngeke libe ngaphezu kwama-degree angu-3 lapho kudlula i-current ye-2A.Uma ububanzi bentambo ingu-1.5mm, ingahlangabezana nezidingo.Kumasekhethi ahlanganisiwe, ikakhulukazi amasekhethi edijithali, i-0.02-0.03mm ivame ukukhethwa.Yebo, inqobo nje uma kuvunyelwe, sisebenzisa izintambo ezibanzi ngangokunokwenzeka, ikakhulukazi izintambo zamandla nezintambo eziphansi ku-PCB.Ibanga elincane phakathi kwezintambo linqunywa ngokuyinhloko ukumelana nokufakwa kwe-insulation kanye ne-voltage yokuphuka phakathi kwezintambo esimweni esibi kakhulu.
Kwamanye amasekhethi ahlanganisiwe (IC), iphimbo lingenziwa libe lincane kuno-5-8mm ngokombono wobuchwepheshe.Ukugoba kocingo oluphrintiwe ngokuvamile kuyi-arc encane kakhulu, futhi ukusetshenziswa kokugoba okungaphansi kwama-degree angama-90 kufanele kugwenywe.I-engeli elungile kanye ne-engeli efakiwe izothinta ukusebenza kukagesi kumjikelezo we-high-frequency.Ngamafuphi, i-wiring yebhodi ephrintiwe kufanele ibe yinto efanayo, iminyene futhi ihambisane.Zama ukugwema ukusetshenziswa kwe-foil yethusi yendawo enkulu kumjikelezo, ngaphandle kwalokho, lapho ukushisa kukhiqizwa isikhathi eside ngesikhathi sokusetshenziswa, i-foil yethusi izokhula futhi iwe kalula.Uma kufanele kusetshenziswe ucwecwe lwethusi olunendawo enkulu, izintambo ezimise okwegridi zingasetshenziswa.Itheminali yocingo yiphedi.Imbobo emaphakathi yephedi inkulu kunobubanzi bomthofu wedivayisi.Uma iphedi likhulu kakhulu, kulula ukwenza i-weld ebonakalayo ngesikhathi sokushisela.Ububanzi obungaphandle bephedi ngokuvamile abukho ngaphansi kuka-(d+1.2) mm, lapho u-d eyisimbobo.Kwezinye izingxenye ezinobukhulu obuphakeme kakhulu, ububanzi obuncane bephedi buyadingeka (d+1.0) mm, ngemva kokuqedwa komklamo wephedi, uhlaka lohlaka lwedivayisi kufanele ludwetshwe eduze kwephedi lebhodi eliphrintiwe, futhi umbhalo nezinhlamvu kufanele zimakwe kanyekanye.Ngokuvamile, ukuphakama kombhalo noma uhlaka kufanele kube ngu-0.9mm, futhi ububanzi bomugqa kufanele bube ngu-0.2mm.Futhi imigqa efana nombhalo omakiwe nezinhlamvu akufanele icindezelwe kuphedi.Uma kuyibhodi elinezingqimba ezimbili, uhlamvu olungezansi kufanele lufane nelebula.
Okwesibili, ukuze wenze umkhiqizo oklanyelwe usebenze kangcono nangempumelelo, i-PCB kufanele icabangele ikhono layo lokulwa nokuphazamiseka ekwakhiweni, futhi inobudlelwano obuseduze nesifunda esithile.
Ukuklanywa komugqa wamandla kanye nomugqa ophansi ebhodini lesifunda kubaluleke kakhulu.Ngokusho kobukhulu bamanje obugeleza ngamabhodi wesifunda ahlukene, ububanzi bomugqa wamandla kufanele bunyuswe ngangokunokwenzeka ukuze kuncishiswe ukumelana ne-loop.Ngesikhathi esifanayo, isiqondiso somugqa wamandla kanye nomugqa ophansi kanye nedatha Isiqondiso sokudlulisa sihlala sinjalo.Faka isandla ekuthuthukisweni kwekhono lokulwa nomsindo lesekhethi.Kukhona kokubili amasekhethi anengqondo namasekhethi aqondile ku-PCB, ukuze ahlukaniswe ngangokunokwenzeka.Isifunda se-low-frequency singaxhunywa ngokuhambisana nephuzu elilodwa.I-wiring yangempela ingaxhunywa ochungechungeni bese ixhunywe ngokuhambisana.Intambo yaphansi kufanele ibe mfushane futhi ishube.I-foil yomhlabathi yendawo enkulu ingasetshenziswa ezingxenyeni ze-high-frequency.Ucingo oluphansi kufanele lube lukhulu ngangokunokwenzeka.Uma ucingo oluphansi luzacile kakhulu, amandla aphansi azoshintsha kanye namanje, okuzonciphisa ukusebenza kokulwa nomsindo.Ngakho-ke, ucingo oluphansi kufanele luqiniswe ukuze lukwazi ukufinyelela okwamanje okuvumelekile ebhodini lesifunda.Uma umklamo uvumela ububanzi bocingo lomhlabathi ukuba bube ngaphezu kuka-2-3mm, kumasekhethi edijithali, ucingo oluphansi lungahlelwa ngaphakathi. iluphu yokuthuthukisa ikhono lokulwa nomsindo.Ekwakhiweni kwe-PCB, ama-decoupling capacitor afanelekile ngokuvamile amiswa ezingxenyeni ezibalulekile zebhodi eliphrintiwe.I-electrolytic capacitor engu-10-100uF ixhunywe kuwo wonke ulayini ekugcineni kokufaka kwamandla.Ngokuvamile, i-0.01PF magnetic chip capacitor kufanele ihlelwe eduze kwephini lamandla le-chip yesekethe ehlanganisiwe enamaphini angu-20-30.Kuma-chips amakhulu, ukuhola kwamandla Kuzoba nezikhonkwane ezimbalwa, futhi kungcono ukwengeza i-decoupling capacitor eduze kwazo.Ngechip enamaphini angu-200, engeza okungenani ama-decoupling capacitor amabili ezinhlangothini zawo ezine.Uma igebe linganele, i-1-10PF tantalum capacitor ingahlelwa futhi kuma-chips angu-4-8.Ezingxenyeni ezinekhono elibuthakathaka lokulwa nokuphazamiseka kanye nezinguquko ezinkulu zokuvala amandla, i-decoupling capacitor kufanele ixhunywe ngokuqondile phakathi kwentambo yamandla kanye nomugqa ophansi wengxenye., Kungakhathaliseki ukuthi hlobo luni lokuhola oluxhunywe ku-capacitor ngenhla, akulula ukuba yinde kakhulu.
3. Ngemuva kokuthi ingxenye kanye nomklamo wesifunda webhodi lesifunda usuphothuliwe, ukwakhiwa kwenqubo yayo kufanele kucatshangelwe ngokulandelayo, ukuze kuqedwe zonke izinhlobo zezinto ezimbi ngaphambi kokuqala kokukhiqiza, futhi ngesikhathi esifanayo, kucatshangelwe ukwenziwa kwe ibhodi lesifunda ukuze kukhiqizwe imikhiqizo esezingeni eliphezulu.kanye nokukhiqizwa ngobuningi.
.. Uma ukhuluma ngokumiswa nokufakwa kwezintambo zezingxenye, ezinye izici zenqubo yebhodi lesifunda ziye zahileleka.Idizayini yenqubo yebhodi lesifunda iwukuhlanganisa ngokuzenzakalelayo ibhodi lesifunda kanye nezingxenye esiziklame ngomugqa wokukhiqiza we-SMT, ukuze sizuze ukuxhumana okuhle kukagesi futhi sifinyelele ukuma kwemikhiqizo yethu eklanyelwe.Idizayini yephedi, izintambo kanye nokunqanda ukuphazamiseka, njll. nakho kudingeka sicabangele ukuthi ibhodi esiliklamile kulula yini ukulikhiqiza, noma lingahlanganiswa nobuchwepheshe besimanje bomhlangano-SMT, futhi ngesikhathi esifanayo, kuyadingeka ukuhlangabezana izimo zokungavumeli imikhiqizo enesici ukuthi ikhiqizwe ngesikhathi sokukhiqiza.phezulu.Ngokukhethekile, kukhona izici ezilandelayo:
1: Imigqa ehlukene yokukhiqiza ye-SMT inezimo zokukhiqiza ezihlukene, kodwa ngokobukhulu be-PCB, usayizi webhodi elilodwa le-PCB awukho ngaphansi kuka-200*150mm.Uma uhlangothi olude luncane kakhulu, ukubekelwa kungasetshenziswa, futhi isilinganiso sobude nobubanzi singu-3:2 noma 4:3.Lapho ubukhulu bebhodi lesifunda bukhulu kuno-200 × 150mm, amandla omshini webhodi lesifunda kufanele acatshangelwe.
2: Uma ubukhulu bebhodi lesifunda buncane kakhulu, kunzima kuyo yonke inqubo yokukhiqiza umugqa we-SMT, futhi akulula ukukhiqiza ngamaqoqo.Indlela engcono kakhulu ukusebenzisa ifomu lebhodi, okuwukuhlanganisa u-2, 4, 6 namanye amabhodi angawodwa ngokuvumelana nobukhulu bebhodi.Kuhlanganiswe ndawonye ukwakha ibhodi eliphelele elifanele ukukhiqizwa ngobuningi, ubukhulu bebhodi lonke kufanele bufanele ubukhulu bebanga elinamathelayo.
3: Ukuze uvumelane nokubekwa komugqa wokukhiqiza, i-veneer kufanele ishiye ububanzi obuyi-3-5mm ngaphandle kwanoma yiziphi izingxenye, futhi iphaneli kufanele ishiye umkhawulo wenqubo engu-3-8mm.Kunezinhlobo ezintathu zokuxhuma phakathi konqenqema lwenqubo kanye ne-PCB: A ngaphandle kokugqagqana, Kukhona ithangi lokuhlukanisa, u-B unezinhlangothi kanye nethangi lokuhlukanisa, futhi u-C unecala futhi alikho ithangi lokuhlukanisa.Ifakwe imishini yenqubo yokubhoboza.Ngokuma kwebhodi le-PCB, kunezinhlobo ezahlukene zamabhodi ejigsaw, njenge-Youtu.Uhlangothi lwenqubo lwe-PCB lunezindlela ezihlukene zokumisa ngokuya ngamamodeli ahlukene, kanti ezinye zinezimbobo zokubeka ohlangothini lwenqubo.Ububanzi bembobo buyi-4-5 cm.Uma sikhuluma ngokuqhathaniswa, ukunemba kokuma kuphakeme kunokwehlangothini, ngakho-ke kukhona Imodeli enezimbobo zokubeka imbobo kufanele inikezwe izimbobo zokubeka ngesikhathi sokucutshungulwa kwe-PCB, futhi ukwakheka kwembobo kufanele kube okujwayelekile ukugwema ukuphazamiseka ekukhiqizeni.
4: Ukuze ube nesimo esingcono futhi uzuze ukunemba okuphezulu kokukhweza, kuyadingeka ukusetha indawo eyinkomba ye-PCB.Ukuthi likhona yini iphoyinti lesithenjwa kanye nokuthi isilungiselelo sihle noma cha sizothinta ngokuqondile ukukhiqizwa ngobuningi bomugqa wokukhiqiza we-SMT.Umumo wephoyinti lesithenjwa ungaba isikwele, isiyingi, unxantathu, njll. Futhi ububanzi kufanele bube phakathi kwebanga lika-1-2mm, futhi indawo ezungezile yephoyinti lereferensi kufanele ibe phakathi kuka-3-5mm, ngaphandle kwanoma yiziphi izingxenye futhi. ihola.Ngesikhathi esifanayo, iphuzu lokubhekisela kufanele libe bushelelezi futhi liyisicaba ngaphandle kokungcola.Umklamo wephoyinti lokubhekisela akufanele usondele kakhulu emaphethelweni ebhodi, kufanele kube nebanga lika-3-5mm.
5: Ngokombono wenqubo yokukhiqiza iyonke, ukwakheka kwebhodi kungcono kube nokumise okwe-pitch, ikakhulukazi i-wave soldering.Unxande ukuze kube lula ukulethwa.Uma kukhona umsele ongekho ebhodini le-PCB, umsele ongekho kufanele ugcwaliswe ngendlela yonqenqema lwenqubo, futhi ibhodi elilodwa le-SMT livunyelwe ukuthi libe nomsele ongekho.Kodwa i-groove engekho akulula ukuba ibe nkulu kakhulu futhi kufanele ibe ngaphansi kuka-1/3 wobude bohlangothi.
Isikhathi sokuthumela: May-06-2023