ʻO ka PCBA a me ka PCB Board Assembly no nā huahana uila
Nā kikoʻī huahana
| KULA NO. | ETP-005 | Kūlana | Hou |
| Min Laulā/Lua | 0.075/0.075mm | Mānoanoa keleawe | 1 – 12 ʻOz |
| Nā ʻano hui | SMT, DIP, Ma o ka Hole | Kahua noi | LED, Lapaʻau, ʻOihana, Papa Mana |
| Holo Nā Laʻana | Loaʻa | Puke Kaʻa | Hoʻopaʻa ʻūmaʻa/Pōhū/Pila/Kaiona |
PCB (PCB Assembly) Hiki ke Kaʻina Hana
| Pono ʻenehana | ʻOihana Hoʻoulu ʻana i ka ʻili a me ka ʻenehana kūʻai ʻana ma o ka lua |
| Nā nui like ʻole e like me 1206,0805,0603 mau mea ʻenehana SMT | |
| ICT (Ma ka Ho'āʻo Kaapuni), ʻenehana FCT (Functional Circuit Test). | |
| Hui PCB Me ka UL, CE, FCC, Rohs Apono | |
| Nitrogen kinoea reflow soldering enehana no SMT | |
| Kiʻekiʻe SMT & Solder Hui Laina | |
| Kiʻekiʻe kiʻekiʻe interconnected 'ike loea hoonoho papa | |
| Manaʻo ʻōlelo a me ka hana ʻana | ʻO Gerber File a i ʻole PCB File no ka hana ʻana i ka Papa PCB Bare |
| ʻO Bom (Bill of Material) no ka ʻAhahui, PNP (E koho a waiho i ka faila) a me ke kūlana o nā mea e pono ai i ka hui. | |
| No ka hōʻemi ʻana i ka manawa ʻōlelo, e ʻoluʻolu e hāʻawi mai iā mākou i ka helu ʻāpana piha no kēlā me kēia ʻāpana, ʻO ka nui o kēlā me kēia papa a me ka nui no nā kauoha. | |
| Ke alakaʻi hoʻāʻo a me ka hana hoʻāʻo ʻana e hōʻoia i ka maikaʻi a hiki i kahi kokoke i 0% scrap rate |
ʻO ke kaʻina hana kūikawā o PCBA
1) Kaʻina hana ʻelua ʻaoʻao maʻamau a me ka ʻenehana.
① ʻOki ʻana i nā mea—hoʻohu—puka a me ka pā piha electroplating—ka hoʻololi ʻana i ke ʻano (ka hoʻokumu ʻana i ke kiʻiʻoniʻoni, ka hoʻolaha ʻana, ka hoʻomohala ʻana)—etching a me ka wehe ʻana i ke kiʻiʻoniʻoni-solder mask a me nā huaʻōlelo—HAL a i ʻole OSP, etc.
② ʻOki ʻana mea—hoʻohu—holeization—hoʻololi ʻano—electroplating—ka wehe ʻana i ke kiʻiʻoniʻoni a me ke kalai ʻana—ka wehe ʻana i nā kiʻiʻoniʻoni anti-corrosion (Sn, a i ʻole Sn/pb)—plating plug- –Solder mask a me nā huapalapala—HAL a i ʻole OSP, etc. —inspection—huahana pau
(2) Kaʻina hana a me ka ʻenehana maʻamau.
ʻO ka ʻoki ʻana i nā mea waiwai—ka hana ʻana o ka papa i loko-ka mālama ʻana i ka oxidation-lamination-drilling-hole plating (hiki ke hoʻokaʻawale ʻia i ka papa piha a me ka hoʻoheheʻe ʻana) - ka hana ʻana o ka papa waho - ka uhi ʻana i ka ʻili - Ka hana ʻana i ke ʻano - Nānā - Huahana pau.
(Nānā 1): ʻO ka hana ʻana o ka papa i loko e pili ana i ke kaʻina hana o ka papa hana ma hope o ka ʻoki ʻia ʻana o ka mea - ka hoʻololi ʻana i ke ʻano (ka hoʻokumu ʻana i ke kiʻiʻoniʻoni, ka hoʻolaha ʻana, ka hoʻomohala ʻana)-etching a me ka wehe ʻana i ke kiʻiʻoniʻoni-nānā, etc.
(Nānā 2): ʻO ka hana ʻana o ka papa waho e pili ana i ke kaʻina hana o ka pā ma o ka hole electroplating—hoʻololi kumu (hoʻokumu kiʻiʻoniʻoni, ʻike, hoʻomohala)—etching a me ka wehe ʻana i ke kiʻiʻoniʻoni.
(Note 3): ʻO ka uhi ʻana o ka ʻili (plating) ʻo ia hoʻi ma hope o ka hana ʻia ʻana o ka papa waho-solder mask a me nā huapalapala-coating (plating) layer (e like me HAL, OSP, chemical Ni/Au, chemical Ag, chemical Sn, etc. ).
(3) Kanu ʻia/makapō ma o ke kaʻina hana papa multilayer a me ka ʻenehana.
Hoʻohana pinepine ʻia nā ʻano lamination sequential.ʻo ia hoʻi:
ʻOki ʻana mea—ka hana ʻana i ka papa koʻikoʻi (e like me ka papa ʻaoʻao ʻelua a i ʻole ka papa ʻāpana nui)—lamination—ʻo ke kaʻina hana e like me ka papa multi-layer maʻamau.
(Nānā 1): ʻO ka hoʻokumu ʻana i ka papa kumu e pili ana i ka hoʻokumu ʻia ʻana o kahi papa multi-layer me nā lua kanu / makapō e like me nā koi hoʻolālā ma hope o ka hoʻokumu ʻia ʻana o ka papa ʻaoʻao ʻelua a multi-layer e nā ʻano hana maʻamau.Inā nui ka hiʻohiʻona o ka puka o ka papa kumu, pono e hoʻokō ʻia ka mālama ʻana i ka hole blocking e hōʻoia i kona hilinaʻi.
(4) Ke kahe kaʻina hana a me ka ʻenehana o ka papa multi-layer laminated.
Hoʻoholo hoʻokahi
Hoikeike Halekuai
Ma ke ʻano he hoahana hana PCB alakaʻi a me ka hui PCB (PCBA), hoʻoikaika ʻo Evertop e kākoʻo i ka ʻoihana liʻiliʻi liʻiliʻi honua me ka ʻike ʻenehana i nā lawelawe ʻenehana Electronic Manufacturing Services (EMS) no nā makahiki.
