Iyo PCB board yekugadzira maitiro inogona kukamurwa kuita gumi nemaviri anotevera matanho.Nzira imwe neimwe inoda zvakasiyana-siyana zvekugadzira nzira.Izvo zvinofanirwa kucherechedzwa kuti iyo nzira yekuyerera kwemapuranga ane akasiyana maitiro akasiyana.Iyi inotevera maitiro ndeye kugadzirwa kwakazara kweakawanda-layer PCB.process flow;
Chekutanga.Inner layer;kunyanya kugadzira yemukati layer redunhu rePCB redunhu bhodhi;nzira yekugadzira ndeiyi:
1. Kucheka bhodhi: kucheka iyo PCB substrate kuita saizi yekugadzira;
2. Pre-atreatment: chenesa pasi pePCB substrate uye bvisa zvinosvibisa pamusoro
3. Laminating firimu: isa firimu rakaoma pamusoro pePCB substrate kugadzirira kuendeswa kwemufananidzo kunotevera;
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5. DE: Iyo substrate mushure mekuratidzwa inogadzirwa, yakatemwa, uye firimu rinobviswa, uye ipapo kugadzirwa kwemukati bhodhi bhodhi kunopedzwa.
Chepiri.Kuongorora kwemukati;kunyanya yekuedza nekugadzirisa mapuranga emapuranga;
1. AOI: AOI optical scanning, iyo inogona kuenzanisa mufananidzo wePCB bhodhi nemashoko ebhodhi yakanaka yezvigadzirwa zvakapinda, kuitira kuti uwane mapeji, kuora mwoyo uye zvimwe zvakashata pamufananidzo webhodhi;
2. VRS: Mufananidzo wakashata waonekwa neAOI uchatumirwa kuVRS kuti ugadziriswe nevashandi vakakodzera.
3. Supplementary wire: Solder waya yegoridhe pane gap kana depression kudzivirira kupera kwemagetsi;
Chetatu.Pressing;sezvinoreva zita racho, mapuranga akawanda emukati anotsikirirwa mubhodhi rimwe;
1. Browning: Browning inogona kuwedzera kunamatira pakati pebhodhi uye resin, uye kuwedzera kunyorova kwepamusoro pemhangura;
2. Riveting: Cheka iyo PP kuita mashiti madiki uye saizi yakajairika kuti bhodhi remukati uye PP inoenderana ikwane pamwechete.
3. Kupindirana nekutsikirira, kupfura, gong edging, edging;
Chechina.Kuchera: zvinoenderana nezvinodiwa nevatengi, shandisa muchina wekuchera kuchera maburi ane madhayamita akasiyana uye saizi pabhodhi, kuitira kuti maburi ari pakati pemapuranga agone kushandiswa kunotevera kugadzirisa plug-ins, uye zvakare inogona kubatsira bhodhi kuti riparare. kupisa;
Chechishanu, mhangura yekutanga;mhangura yemhangura yemakomba akacherwa ekunze kwepuranga, kuitira kuti mitsara yega yega yebhodhi iitwe;
1. Deburring line: bvisa maburrs pamucheto wegomba rebhodhi kudzivirira kusvibiswa kwemhangura;
2. Glue kubvisa mutsara: bvisa glue residu mugomba;kuitira kuwedzera kunamatira panguva ye micro-etching;
3. Imwe mhangura (pth): Mhangura yemhangura mugomba inoita dunhu rega rega rega rebhodhi conduction, uye panguva imwechete inowedzera mhangura yemhangura;
Yechitanhatu, iyo yekunze;chikamu chekunze chinenge chakangofanana nechomukati chemukati danho rekutanga, uye chinangwa chayo ndechekufambisa nzira yekutevera kuita dunhu;
1. Pre-atreatment: Chenesa pamusoro pebhodhi ne pickling, brushing uye kuomesa kuti uwedzere kusungirirwa kwefirimu yakaoma;
2. Laminating firimu: isa firimu rakaoma pamusoro pePCB substrate kugadzirira kuendeswa kwemufananidzo kunotevera;
3. Exposure: irradiate neUV chiedza kuita kuti firimu yakaoma pabhodhi iite chimiro chepolymerized uye unpolymerized;
4. Kubudirira: bvisa iyo yakaoma firimu iyo isina polymerized panguva yekuratidzwa, ichisiya gap;
Yechinomwe, yechipiri mhangura uye etching;yechipiri mhangura plating, etching;
1. Chechipiri mhangura: Electroplating pattern, cross chemical copper yenzvimbo isina kuvharwa nefirimu yakaoma mugomba;panguva imwe chete, kuwedzera kuwedzera conductivity uye mhangura ukobvu, uye ipapo enda kuburikidza tin plating kudzivirira kuvimbika redunhu nemakomba panguva etching;
2. SES: Nyora pasi pasi mhangura munzvimbo yakanamirwa yekunze firimu yakaoma (yakanyorova firimu) kuburikidza nematanho akadai sekubvisa firimu, etching, uye tin kubvisa, uye yekunze layer yedunhu yapera;
Yechisere, solder kuramba: inogona kuchengetedza bhodhi uye kudzivirira oxidation uye zvimwe zviitiko;
1. Pretreatment: pickling, ultrasonic washing uye mamwe maitiro ekubvisa oxides pabhodhi uye kuwedzera roughness pamusoro pemhangura;
2. Kudhinda: Vhara zvikamu zvePCB board zvisingadi kutengeswa ne solder resist inki kuita basa rekudzivirira nekudzivirira;
3. Pre-kubika: kuomesa solvent mu solder kuramba inki, uye panguva imwe chete kuomesa inki nokuda kuratidzwa;
4. Exposure: Kurapa solder kuramba ingi ne UV chiedza irradiation, uye kugadzira yakakwirira molecular polymer kuburikidza photopolymerization;
5. Kubudirira: bvisa sodium carbonate solution muinki isina polymerized;
6. Mushure mekubika: kuomesa zvizere inki;
Yechipfumbamwe, chinyorwa;zvinyorwa zvakadhindwa;
1. Pickling: Chenesa pamusoro pebhodhi, bvisa oxidation yepamusoro kuti usimbise kunamatira kweinki yekudhinda;
2. Rugwaro: zvinyorwa zvakadhindwa, zviri nyore kune inotevera welding process;
Chegumi, pamusoro kurapwa OSP;rutivi rweplate yemhangura isina kuvharwa inoputirwa kuti iite firimu rehupenyu kudzivirira ngura uye oxidation;
Yegumi nerimwe, kuumba;chimiro chebhodhi chinodiwa nemutengi chinogadzirwa, icho chiri nyore kuti mutengi aite SMT kuiswa uye kusangana;
Chegumi nembiri, bvunzo yekuongorora inobhururuka;edza dunhu rebhodhi kuti udzivise kubuda kwebhodhi redunhu pfupi;
Yegumi nenhatu, FQC;kuongorora kwekupedzisira, sampling uye kuongorora kwakazara mushure mekupedza maitiro ese;
Yegumi neina, kurongedza uye kunze kwedura;vacuum-pack iyo yakapedzwa PCB bhodhi, rongedza uye ngarava, uye pedzisa kuendesa;
Nguva yekutumira: Kubvumbi-24-2023