Habka wax soo saarka guddiga PCB waxa loo qaybin karaa qiyaas ahaan laba iyo toban tilaabo ee soo socda.Nidaam kastaa wuxuu u baahan yahay hab-soosaar kala duwan.Waa in la ogaadaa in socodka habka looxyada leh qaabab kala duwan ay kala duwan yihiin.Habka soo socda ayaa ah soo saarista dhamaystiran ee PCB-da lakabyada badan.socodka habka;
Marka hore.Lakabka gudaha;inta badan samaynta wareegga lakabka gudaha ee guddiga wareegga PCB;habka wax soo saarku waa:
1. Goynta guddiga: goynta substrate PCB ee cabbirka wax soo saarka;
2. Daawaynta ka hor: nadiifi dusha sare ee substrate PCB kana saar wasakhowga dusha
3. Filim laminating: ku dheji filimka qalalan dusha sare ee substrate PCB si aad isugu diyaariso wareejinta sawirka xigta;
4. Soo-gaadhista: Isticmaal qalabka soo-gaadhista si aad u soo bandhigto substrate-ku-xiran ee filimka leh iftiinka ultraviolet, si loogu wareejiyo sawirka substrate-ka filimka qalalan;
5. DE: Substrate ka dib soo-gaadhista ayaa la horumariyaa, la dhejiyaa, lagana saaraa filimka, ka dibna wax soo saarka guddiga lakabka gudaha waa la dhammeeyaa.
Labaad.Kormeerka gudaha;inta badan baaritaanka iyo hagaajinta wareegyada guddiga;
1. AOI: Sawirka indhaha ee AOI, kaas oo barbar dhigi kara sawirka guddiga PCB-ga iyo xogta guddiga alaabta wanaagsan ee la geliyey, si loo helo meelaha bannaan, niyad-jabka iyo dhacdooyinka kale ee xun ee sawirka guddiga;
2. VRS: Xogta sawirka xun ee ay ogaatay AOI waxa loo diri doona VRS si ay u hagaajiyaan shaqaalaha ay khusayso.
3. Silig dheeri ah: Ku iibi fiilada dahabka ah ee farqiga u dhexeeya ama niyad-jabka si looga hortago cillad koronto;
Saddexaad.Cadaadiska;Sida magacu tilmaamayo, looxyo badan oo gudaha ah ayaa lagu riixaa hal loox;
1. Browning: Browning waxay kordhin kartaa xabagta u dhaxaysa looxa iyo xabagta, waxayna kordhisaa qoynta dusha naxaasta;
2. Riveting: U jar PP-ga go'yaal yaryar iyo cabbir caadi ah si aad uga dhigto sabuuradda gudaha iyo PP-ga u dhigma inay isla jaan qaadaan
3. Isku-dubbarid iyo cadaadis, toogto, gees-goyn, gees-goyn;
Afaraad.Qodista: sida waafaqsan shuruudaha macaamiisha, isticmaal mashiinka qodista si aad u qoddo godad leh dhexroor iyo cabbir kala duwan oo looxa ah, si godadka u dhexeeya looxyada loo isticmaalo habraaca dambe ee plug-ins, sidoo kale waxay caawin kartaa guddiga inuu kala daadiyo. kulaylka;
Shanaad, naxaasta aasaasiga ah;dahaadhka naxaasta ah ee godadka la qoday ee looxa lakabka sare, si xadhkaha lakabka kasta ee looxa loo qabto;
1. Xariiqda deburinta: ka saar burooyinka ku yaal cidhifka godka looxa si aad uga hortagto dahaadh xun oo naxaas ah;
2. Xabagta saarista xabagta: ka saar haraaga xabagta ee godka;si loo kordhiyo adhesion inta lagu jiro micro-etching;
3. Mid ka mid ah naxaas (pth): Dajinta naxaasta ee daloolka ayaa ka dhigaysa wareegga lakab kasta oo ka mid ah guddiga guddiga, isla markaana waxay kordhisaa dhumucda naxaasta;
Lixaad, lakabka sare;lakabka sare ayaa qiyaas ahaan la mid ah habka lakabka gudaha ee talaabada ugu horeysa, ujeedadeeduna waa in la fududeeyo habka dabagalka si loo sameeyo wareegga;
1. Daawaynta ka hor: Nadiifi dusha sare ee looxa adoo qaadaya, cadaynaya oo qallajinaya si aad u kordhiso xabagta filimka qalalan;
2. Filim laminating: ku dheji filimka qalalan dusha sare ee substrate PCB si aad isugu diyaariso wareejinta sawirka xigta;
3. Soo-gaadhista: shucaac leh iftiinka UV si aad u sameyso filimka qalalan ee sabuuradda oo ka sameysma xaalad polymerized iyo unpolymerized;
4. Horumarinta: kala diri filimka qalalan ee aan la polymerized inta lagu jiro habka soo-gaadhista, ka tagista farqiga;
Ta toddobaad, naxaasta sare iyo xoqidda;dahaarka naxaasta sare, xoqin;
1. Naxaasta labaad: Habka korantada, iskutallaabta naxaasta kiimikada ee meesha aan lagu daboolin filimka qallalan ee daloolka;Isla mar ahaantaana, sii kordhinta conductivity iyo dhumucda naxaasta, ka dibna dhex mara daasadda daasadda si ay u ilaaliyaan daacadnimada wareegga iyo godadka inta lagu guda jiro etching;
2. SES: Ku dheji naxaasta hoose ee aagga lifaaqa ee lakabka sare ee filimka qalalan (filimka qoyan) iyada oo loo marayo hababka sida ka saarista filimka, xoqidda, iyo daasadaha, iyo wareegga lakabka dibadda ayaa hadda la dhammeeyey;
Sideedaad, caabbinta alxanka: waxay ilaalin kartaa guddiga waxayna ka hortagi kartaa oksaydhka iyo ifafaale kale;
1. Pretreatment: pickling, ultrasonic dhaqidda iyo hababka kale si looga saaro oksaydhyada on guddiga iyo in la kordhiyo qallafsanaan ee dusha naxaas ah;
2. Daabacaadda: Dabool qaybaha looxa PCB-ga ee aan u baahnayn in lagu iibiyo alxanka caabbinta si ay u ciyaaraan doorka ilaalinta iyo dahaarka;
3. Dubidda ka hor: qallajinta dareeraha ku jira alxanka ayaa u adkaysta khad, isla markaana adkaynaysa khad si ay u soo baxdo;
4. Soo-gaadhis: Daawaynta alxanka caabbinta khad by shucaaca iftiinka UV, iyo samaynta polymer molecular sare iyada oo loo marayo photopolymerization;
5. Horumarinta: ka saar xalka sodium carbonate ee khad aan polymerized ah;
6. Dubo ka dib: si buuxda loo adkeeyo khad;
Sagaalaad, qoraal;qoraalka daabacan;
1. Pickling: Nadiifi dusha sare ee looxa, ka saar oksaydhaynta dusha si aad u xoojiso adhesion ee qalin daabacaadda;
2. Qoraal: qoraal daabacan, oo ku habboon habka alxanka xiga;
Tobnaad, daaweynta dusha OSP;dhinaca saxanka naxaasta ah ee qaawan ee alxanka ayaa lagu dahaadhay si loo sameeyo filim dabiici ah si looga hortago miridhku iyo oksaydhka;
Kow iyo tobnaad, samaynta;qaabka looxa uu u baahan yahay macmiilku waa la soo saaraa, taas oo ku habboon macaamilka si ay u fuliyaan meelaynta SMT iyo isu-ururinta;
Laba iyo tobnaad, tijaabada baaritaanka duulista;tijaabi wareegga guddiga si aad uga fogaato qulqulka wareegga gaaban;
Saddex iyo tobnaad, FQC;kormeerka ugu dambeeya, shaybaarka iyo kormeerka buuxa ka dib marka la dhammeeyo dhammaan hababka;
Afar iyo tobnaad, baakadaha iyo ka baxsan bakhaarka;vacuum-ku xidh guddiga PCB-ga ee dhammaatay, baakad iyo rar, oo dhammaystir keenista;
Waqtiga boostada: Abriil-24-2023